A study of UV-curable epoxide resins containing thermal accelerator : Tertiary aminesTZU HSUAN CHIANG; HSIEH, T.-E.Reactive & functional polymers. 2008, Vol 68, Num 2, pp 601-612, issn 1381-5148, 12 p.Article

Transparent photo-curable co-polyacrylate/silica nanocomposites prepared by sol-gel processCHOU, Yen-Chun; WANG, Yu-Young; HSIEH, T.-E et al.Journal of applied polymer science. 2007, Vol 105, Num 4, pp 2073-2082, issn 0021-8995, 10 p.Article

A study of monomer's effect on adhesion strength of UV-curable resinsTZU HSUAN CHIANG; HSIEH, T.-E.International journal of adhesion and adhesives. 2006, Vol 26, Num 7, pp 520-531, issn 0143-7496, 12 p.Article

The effect of organo-functional silanes on the adhesion of epoxide resins to ITO glassTZU HSUAN CHIANG; HSIEH, T.-E.Journal of adhesion science and technology. 2005, Vol 19, Num 1, pp 1-18, issn 0169-4243, 18 p.Article

The nitrogen doping effect on the properties of Ge-In-Sb-Te phase-change recording media investigated by blue-light laserYEH, Tung-Ti; HSIEH, T.-E; SHIEH, Han-Ping D et al.Thin solid films. 2005, Vol 488, Num 1-2, pp 211-216, issn 0040-6090, 6 p.Article

On the search for experimentally observed grain boundary phase transitions = Sur la recherche des transitions de phase aux joints de grains observées expérimentalementBALLUFFI, R. W; HSIEH, T. E.Journal de physique. Colloques. 1988, Num 10, pp C5.337-C5.349, issn 0449-1947Conference Paper

Solid phase epitaxy for low pressure chemical vapor deposition Si films induced by ion implantationCHEN, P.-S; HSIEH, T. E; CHU, C.-H et al.Thin solid films. 1999, Vol 353, Num 1-2, pp 274-282, issn 0040-6090Article

Thin-film reactions during diffusion soldering of Cu/Ti/Si and Au/Cu/Al₂O₃ with Sn interlayersLIANG, M. W; HSIEH, T. E; CHANG, S. Y et al.Journal of electronic materials. 2003, Vol 32, Num 9, pp 952-956, issn 0361-5235, 5 p.Article

A method to enhance the data transfer rate of phase change recording mediaYEH, Tung-Ti; HSIEH, T. E; SHIEH, Han-Ping D et al.SPIE proceedings series. 2004, pp 515-523, isbn 0-8194-5293-9, 9 p.Conference Paper

Copper voids improvement for the copper dual damascene interconnection processWANG, T. C; WANG, Y. L; HSIEH, T. E et al.The Journal of physics and chemistry of solids. 2008, Vol 69, Num 2-3, pp 566-571, issn 0022-3697, 6 p.Conference Paper

Efficiency improvement of flexible phosphorescent organic light emitting diode by inserting a buffer layerTSAI, Y. S; WANG, S. H; JUANG, F. S et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 68911A.1-68911A.6, issn 0277-786X, isbn 978-0-8194-7066-9, 1VolConference Paper

Comparison of characteristics and integration of copper diffusion-barrier dielectricsWANG, T. C; CHENG, Y. L; WANG, Y. L et al.Thin solid films. 2006, Vol 498, Num 1-2, pp 36-42, issn 0040-6090, 7 p.Conference Paper

Copper surface protection with a completely enclosed copper structure for a damascene processWANG, T. C; HSIEH, T. E; WANG, Y. L et al.Thin solid films. 2004, Vol 447-48, pp 542-548, issn 0040-6090, 7 p.Conference Paper